Jack Cheng

Hong Kong University of Science and Technology (HKUST)
IPC 2022 featured speaker

Professor Jack CHENG is an Associate Head and Professor in the Department of Civil and Environmental Engineering, Associate Director of GREAT Smart Cities Institute, Director of BIM Lab, and Director of Radio Frequency Identification (RFID) Center at the Hong Kong University of Science and Technology (HKUST). He obtained his Bachelor degree with First Class Honors and his MPhil degree from HKUST, and then obtained his PhD degree from Stanford University. His research interests include BIM, digital twin, Internet of Things, artificial intelligence, construction robotics, blockchain, construction and facility management, smart and low carbon buildings, and construction digitalization. He has led a number of Research and Development projects in smart buildings and construction. He is an author of over 250 international journal and conference publications.

 

Professor CHENG is currently a Council Member of the Hong Kong Construction Industry Council (CIC), the Chairperson of Task Force on BIM Standards of CIC, a Member of the BIM Committee and Construction Safety Committee of CIC, Honorary Treasurer of the Hong Kong Institute of Building Information Modeling (HKIBIM), a Director of the Hong Kong Green Building Council (HKGBC), and Editorial Board Member of several international journals. He is a Past President of the American Society of Civil Engineers (ASCE) Greater China Section, Past Chair of ASCE Global Center for Excellence in Computing, and Past Chairman of the Autodesk Industry Advisory Board. Prof. CHENG is a Fellow Member of the Hong Kong Institute of Civil and Building Information Management (HKICBIM), Professional Member of the HKIBIM, CIC Certified BIM Manager (CCBM), Certified ISO 19650 Information Manager, and Certified Carbon Auditor Professional (CAP). He has received the Construction Industry Outstanding Person Award in 2019 and Young BIMer of the Year in 2014 from CIC, and a few research and paper awards in international conferences.

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Robotics, AI and Blockchain: Unlocking the Opportunities of Automation and Digitalization for AECO Applications

There is a global trend of increasing adoption of digital technologies in the Architecture, Engineering, Construction and Operations (AECO) industry. Building information modeling (BIM) is undoubtedly one of the key technologies that support digitalization of the AECO industry.

 

However, as the need for digitalization has increased and the amount of digital data has grown rapidly, traditional manual approaches to processes such as BIM reconstruction, site inspection, and defect detection cannot meet the current needs. People are also increasingly concerned about the security of the data being stored and shared.

 

In this presentation, the opportunities of robotics and artificial intelligence (AI) for automatic BIM reconstruction and site inspection will be discussed and illustrated. Techniques on robotic path planning and autonomous operations will be shared. The use of blockchain technology for enhancing data security and traceability for AECO applications will also be presented. In particular, novel data structures and blockchain-based smart contracts for secure information management in building design and construction will be presented. Technical challenges and future directions will then be discussed at the end.